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The six engineering capabilities RETONAI delivers.
Open →Edge AI Retrofit & System Integration
Add on-device AI to the cameras, sensors, controllers and machines you already run: interface assessment, right-sized compute, integrated firmware, validated models and device security as one system.
Open →AI Hardware & Electronics R&D
Architecture definition, MCU/SoC/FPGA/NPU/GPU compute selection, memory, interfaces, power and thermal design, and board bring-up for edge AI hardware.
Open →Embedded Firmware & Edge Platforms
Boot chain, BSP and drivers, Embedded Linux and RTOS, sensor pipelines, telemetry, secure OTA updates, diagnostics and recovery for the life of the fleet.
Open →Embedded AI & ML Optimisation
Model selection, quantisation, pruning and hardware-aware optimisation for on-device inference, benchmarked on the target hardware and deployed with updates.
Open →Cybersecurity Software & Device Security
Threat modelling, secure boot, device identity, signed updates, data and model protection, runtime hardening, monitoring and recovery, designed in from the first decision.
Open →PCB, Mechanical & Product Engineering
Schematic and multilayer PCB design, high-speed interfaces, signal and power integrity, EMC, thermal, DFM/DFA/DFT and prototype bring-up for embedded products.
Open →Technology
How the RETONAI edge stack works: six layers, constraints, security, evidence, platforms, R&D.
Open →About
RETONAI PTE. LTD., the founder, principles and Singapore base.
Open →Contact
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Open →Data Protection Notice
How personal data is handled under the PDPA.
Open →Terms of Use
Terms governing use of retonai.com.
Open →Last updated